Izixhobo zokumakisha laser ze-UV

Iingenelo eziphambili:
1. I-laser ye-UV, ngenxa yendawo yayo encinci yokugxila kunye nobushushu obuncinci bendawo echaphazelekileyo, inokwenza uphawu lwe-ultra ecolekileyo kunye nokumakishwa kwezinto ezizodwa, iyenze ibe yimveliso ekhethwayo kubathengi abaneemfuno eziphezulu zokumakisha ukusebenza.
2. I-laser ye-UV ifanelekile ukucubungula uluhlu olubanzi lwezixhobo ngaphandle kobhedu.
3. Isantya sokumakisha ngokukhawuleza kunye nokusebenza okuphezulu; Umatshini wonke uneenzuzo ezifana nokusebenza okuzinzile, ubungakanani obuncinci, kunye nokusetyenziswa kwamandla aphantsi .. I-laser ye-UV iyindawo yokukhanya ekhethiweyo yokumakisha iplastiki ngaphandle kweemfuno ze-tactile, kunye nombala omnyama kunye nohlaza okwesibhakabhaka, iyunifomu, kunye nokusebenza kakuhle okuphakathi.
Umda wesicelo:
Isetyenziswa kakhulu kwimakethi ephezulu ye-ultra fine processing, ukumakishwa komphezulu weebhotile zokupakisha kwiifowuni eziphathwayo, iitshaja, iintambo zedatha, iziyobisi, izimonyo, iividiyo kunye nezinye izinto zepolymer zichaneke kakhulu, kunye nokumakishwa okucacileyo kunye okuqinileyo, okungaphezulu kwekhowudi ye-inki kunye nokungcola; Ukumakishwa kwebhodi ye-PCB eguquguqukayo kunye nokubhala: i-silicon wafer micro hole, ukusetyenzwa komngxuma oyimfama, njl.
Iimpawu zeSoftware: Inkxaso yokuhlela umbhalo wegophe elingenasizathu, umzobo womzobo, isiTshayina kunye nesiNgesi umsebenzi wokufakwa kombhalo wedijithali, umsebenzi wokuvelisa ikhowudi enye-dimensional/two-two-dimensional, ifayile yevector/ifayile yebitmap/ifayile eguquguqukayo, inkxaso yeelwimi ezininzi, inokudityaniswa nomsebenzi wokumakisha ojikelezayo, ukumakishwa kwendiza, uphuhliso lwesibini lwesoftware, njl.