Imishini yokumaka i-UV laser

Izinzuzo eziyinhloko:
1. Ilaser ye-UV, ngenxa yendawo yayo encane kakhulu egxilile kanye nendawo ethintekile yokucubungula ukushisa, ingenza uphawu oluhle kakhulu kanye nokumaka okukhethekile, okuyenze ibe umkhiqizo okhethwayo wamakhasimende anezidingo eziphakeme zokumaka ukusebenza kahle.
2. I-UV laser ilungele ukucubungula uhla olubanzi lwezinto ngaphandle kwethusi.
3. Isivinini sokumaka ngokushesha nokusebenza kahle okuphezulu; Wonke umshini unezinzuzo ezifana nokusebenza okuzinzile, usayizi omncane, nokusetshenziswa kwamandla okuphansi. Ilaser ye-UV iwumthombo wokukhanya okhethwayo wokumaka ipulasitiki ngaphandle kwezidingo ezithintekayo, ezinombala omnyama noluhlaza okwesibhakabhaka, umfaniswano, nokusebenza kahle okusesilinganisweni.
Ububanzi bohlelo lokusebenza:
Ikakhulukazi esetshenziswa emakethe ephezulu yokucubungula okuhle kakhulu, ukumaka okungaphezulu kwamabhodlela okupakisha omakhalekhukhwini, amashaja, izintambo zedatha, izidakamizwa, izimonyo, amavidiyo, nezinye izinto ze-polymer zinembile kakhulu, ezinezimpawu ezicacile neziqinile, ziphakeme kunokubhala nge-inki nokungangcoli; Ukumaka nokubhala kwebhodi le-PCB okuguquguqukayo: i-silicon wafer micro hole, ukucubungula imbobo eyimpumputhe, njll.
Izici zesofthiwe: Ukusekelwa kokuhlela umbhalo wejika ongaqondakali, umdwebo wezithombe, umsebenzi wokufakwayo kombhalo wedijithali wesiShayina nesiNgisi, umsebenzi wokukhiqiza ikhodi enohlangothi olulodwa/ezimbili, ifayela le-vector/ifayela le-bitmap/ifayela eliguquguqukayo, ukusekelwa kwezilimi eziningi, kungahlanganiswa nomsebenzi wokumaka ngokuzungeza, ukumakwa kwendiza, ukuthuthukiswa kwesoftware, njll.